Strategy for Fabricating Ultrathin Au Film Electrodes with Ultralow Optoelectrical Losses and High Stability.

A vital objective in the wetting of Au deposited on chemically heterogeneous oxides is to synthesize a completely continuous, highly crystalline, ultrathin-layered geometry with minimized electrical and optical losses. However, no effective solution has been proposed for synthesizing an ideal Au-layered structure. This study presents evidence for the effectiveness of atomic oxygen-mediated growth of such an ideal Au layer by improving Au wetting on ZnO substrates with a substantial reduction in free energy. The unexpected outcome of the atomic oxygen-mediated Au growth can be attributed to the unconventional segregation and incorporation of atomic oxygen along the outermost boundaries of Au nanostructures evolving in the clustering and layering stages. Moreover, the experimental and numerical investigations revealed the spontaneous migration of atomic oxygen from an interstitial oxygen surplus ZnO bulk to the Au-ZnO interface, as well as the segregation (float-out) of the atomic oxygen toward the top Au surfaces. Thus, the implementation of a 4-nm-thick, two-dimensional, quasi-single-crystalline Au layer with a nearly complete crystalline realignment at a mild temperature (570 K) enabled exceptional optoelectrical performance with record-low resistivity (<7.5 × 10-8 Ω·m) and minimal optical loss (∼3.5%) at a wavelength of 700 nm.

Effect of carbon addition on the passivity of hypoeutectic high chromium cast irons.

The effect of adding C on the passivity of hypoeutectic high chromium cast iron (HCCI) was investigated in a pH 8.4 boric-borate buffer solution. The microstructure of HCCI is composed of austenite and carbide phases, whose fractions and chemical compositions are influenced by the amount of C added. Electrochemical and surface analyses revealed that the addition of C in the HCCI increased the defect densities in the n-type and p-type semiconductive oxide layers on the austenite and carbide phases, respectively.

An unexpected surfactant role of immiscible nitrogen in the structural development of silver nanoparticles: an experimental and numerical investigation.

Artificially designing the crystal orientation and facets of noble metal nanoparticles is important to realize unique chemical and physical features that are very different from those of noble metals in bulk geometries. However, relative to their counterparts synthesized in wet-chemical processes, vapor-depositing noble metal nanoparticles with the desired crystallographic features while avoiding any notable impurities is quite challenging because this task requires breaking away from the thermodynamically favorable geometry of nanoparticles. We used plasma-generated N atoms as a surface-active agent, a so-called surfactant, to control the structural development of Ag nanoparticles supported on a chemically heterogeneous ZnO substrate. The N-surfactant-facilitated sputter deposition provided strong selectivity for crystalline orientation and facets, leading to a highly flattened nanoparticle shape that clearly deviated from the energetically favorable spherical polyhedra, due to the drastic decreases in the surface free energies of Ag nanoparticles in the presence of the N surfactant. The Ag nanoparticles successively developed a nearly unidirectional (111) orientation aligned by stimulating the crystalline coupling of Ag along the orientation of the ZnO substrate. The experimental and simulation results not only offer new insights into the advantages of N as a surfactant for the orientation and shape-controlled synthesis of Ag nanoparticles via sputter deposition but also provide the first solid evidence validating that immiscible, nonresidual gaseous surfactants can be used in the vapor deposition processes of noble metal nanoparticles to manipulate their surface free energies.

Ultrathin Silver Film Electrodes with Ultralow Optical and Electrical Losses for Flexible Organic Photovoltaics.

Improving the wetting ability of Ag on chemically heterogeneous oxides is technically important to fabricate ultrathin, continuous films that would facilitate the minimization of optical and electrical losses to develop qualified transparent Ag film electrodes in the state-of-the-art optoelectronic devices. This goal has yet to be attained, however, because conventional techniques to improve wetting of Ag based on heterogeneous metallic wetting layers are restricted by serious optical losses from wetting layers. Herein, we report on a simple and effective technique based on the partial oxidation of Ag nanoclusters in the early stages of Ag growth. This promotes the rapid evolution of the subsequently deposited pure Ag into a completely continuous layer on the ZnO substrate, as verified by experimental and numerical evidence. The improvement in the Ag wetting ability allows the development of a highly transparent, ultrathin (6 nm) Ag continuous film, exhibiting an average optical transmittance of 94% in the spectral range 400-800 nm and a sheet resistance of 12.5 Ω sq-1, which would be well-suited for application to an efficient front window electrode for flexible solar cell devices fabricated on polymer substrates.

Optical Transmittance Enhancement of Flexible Copper Film Electrodes with a Wetting Layer for Organic Solar Cells.

The development of highly efficient flexible transparent electrodes (FTEs) supported on polymer substrates is of great importance to the realization of portable and bendable photovoltaic devices. Highly conductive, low-cost Cu has attracted attention as a promising alternative for replacing expensive indium tin oxide (ITO) and Ag. However, highly efficient, Cu-based FTEs are currently unavailable because of the absence of an efficient means of attaining an atomically thin, completely continuous Cu film that simultaneously exhibits enhanced optical transmittance and electrical conductivity. Here, strong two-dimensional (2D) epitaxy of Cu on ZnO is reported by applying an atomically thin (around 1 nm) oxygen-doped Cu wetting layer. Analyses of transmission electron microscopy images and X-ray diffraction patterns, combined with first-principles density functional theory calculations, reveal that the reduction in the surface and interface free energies of the wetting layers with a trace amount (1-2 atom %) of oxygen are largely responsible for the two-dimensional epitaxial growth of the Cu on ZnO. The ultrathin 2D Cu layer, embedded between ZnO films, exhibits a highly desirable optical transmittance of over 85% in a wavelength range of 400-800 nm and a sheet resistance of 11 Ω sq-1. The validity of this innovative approach is verified with a Cu-based FTE that contributes to the light-to-electron conversion efficiency of a flexible organic solar cell that incorporates the transparent electrode (7.7%), which far surpasses that of a solar cell with conventional ITO (6.4%).

Simultaneous increase in strength and ductility by decreasing interface energy between Zn and Al phases in cast Al-Zn-Cu alloy.

Cast-Al alloys that include a high amount of the second element in their matrix have comparatively high strength but low ductility because of the high volume fraction of strengthening phases or undesirable inclusions. Al-Zn alloys that have more than 30 wt% Zn have a tensile strength below 300 MPa, with elongation under 5% in the as-cast state. However, we found that after substitution of 2% Zn by Cu, the tensile strength of as-cast Al-Zn-Cu alloys was 25% higher and ductility was four times higher than for the corresponding Al-35% Zn alloy. Additionally, for the Al-43% Zn alloy with 2% Cu after 1 h solution treatment at 400 °C and water quenching, the tensile strength unexpectedly reached values close to 600 MPa. For the Al-33% Zn alloy with 2% Cu, the tensile strength was 500 MPa with 8% ductility. The unusual trends of the mechanical properties of Al-Zn alloys with Cu addition observed during processing from casting to the subsequent solution treatment were attributed to the precipitation of Zn in the Al matrix. The interface energy between the Zn particles and the Al matrix decreased when using a solution of Cu in Zn.

Increasing strength and conductivity of Cu alloy through abnormal plastic deformation of an intermetallic compound.

The precipitation strengthening of Cu alloys inevitably accompanies lowering of their electric conductivity and ductility. We produced bulk Cu alloys arrayed with nanofibers of stiff intermetallic compound through a precipitation mechanism using conventional casting and heat treatment processes. We then successfully elongated these arrays of nanofibers in the bulk Cu alloys to 400% of original length without breakage at room temperature using conventional rolling process. By inducing such an one-directional array of nanofibers of intermetallic compound from the uniform distribution of fine precipitates in the bulk Cu alloys, the trade-off between strength and conductivity and between strength and ductility could be significantly reduced. We observed a simultaneous increase in electrical conductivity by 1.3 times and also tensile strength by 1.3 times in this Cu alloy bulk compared to the conventional Cu alloys.

Design of exceptionally strong and conductive Cu alloys beyond the conventional speculation via the interfacial energy-controlled dispersion of γ-Al2O3 nanoparticles.

The development of Cu-based alloys with high-mechanical properties (strength, ductility) and electrical conductivity plays a key role over a wide range of industrial applications. Successful design of the materials, however, has been rare due to the improvement of mutually exclusive properties as conventionally speculated. In this paper, we demonstrate that these contradictory material properties can be improved simultaneously if the interfacial energies of heterogeneous interfaces are carefully controlled. We uniformly disperse γ-Al2O3 nanoparticles over Cu matrix, and then we controlled atomic level morphology of the interface γ-Al2O3//Cu by adding Ti solutes. It is shown that the Ti dramatically drives the interfacial phase transformation from very irregular to homogeneous spherical morphologies resulting in substantial enhancement of the mechanical property of Cu matrix. Furthermore, the Ti removes impurities (O and Al) in the Cu matrix by forming oxides leading to recovery of the electrical conductivity of pure Cu. We validate experimental results using TEM and EDX combined with first-principles density functional theory (DFT) calculations, which all consistently poise that our materials are suitable for industrial applications.

Reliable and cost effective design of intermetallic Ni2Si nanowires and direct characterization of its mechanical properties.

We report that a single crystal Ni2Si nanowire (NW) of intermetallic compound can be reliably designed using simple three-step processes: casting a ternary Cu-Ni-Si alloy, nucleate and growth of Ni2Si NWs as embedded in the alloy matrix via designing discontinuous precipitation (DP) of Ni2Si nanoparticles and thermal aging, and finally chemical etching to decouple the Ni2Si NWs from the alloy matrix. By direct application of uniaxial tensile tests to the Ni2Si NW we characterize its mechanical properties, which were rarely reported in previous literatures. Using integrated studies of first principles density functional theory (DFT) calculations, high-resolution transmission electron microscopy (HRTEM), and energy-dispersive X-ray spectroscopy (EDX) we accurately validate the experimental measurements. Our results indicate that our simple three-step method enables to design brittle Ni2Si NW with high tensile strength of 3.0 GPa and elastic modulus of 60.6 GPa. We propose that the systematic methodology pursued in this paper significantly contributes to opening innovative processes to design various kinds of low dimensional nanomaterials leading to advancement of frontiers in nanotechnology and related industry sectors.

Nano-eutectic growth in Co-17.8 wt%Gd alloy ribbons and the magnetostrictive properties at different wheel speeds.

Under near-equilibrium solidification conditions, the Co-17.8 wt%Gd eutectic alloy forms rod-like eutectic microstructure of (αCo) solid solution and Co17Gd2 compound. When the solidification condition is far from the equilibrium, the rapid growth of nano-eutectic in Co-17.8 wt%Gd alloy ribbons is realized by the single-roller techniques. The average granular size (d) of nano-eutectic in the center of ribbons varies with the increase of wheel speed (V), d = 510.36-25.51 V+0.44 V2. XRD results of ribbons at different wheel speeds indicate that, with the rise of wheel speed, the main peak of Co17Gd2 compound becomes more and more notable, whereas the main peak of (αCo) solid solution tends to reduce. Along the length direction, the Co-17.8 wt%Gd alloy ribbons have the negative magnetostrictive strain. The magnetostrictive strain enhances with the increase of wheel speed. At the wheel speed of 40 m/s, the magnetostrictive coefficient of ribbons is measured to be - 733 ppm at the magnetic field of 6 kOe. The influence of the wheel speed and the magnetic field on the maanetostrictive coefficient is discussed.

Annealing characteristics of nanostructured Cu-Fe-P alloy processed by accumulative roll-bonding.

Annealing characteristics of a nanostructured copper alloy processed by accumulative roll-bonding (ARB) were studied. A nano-grained Cu-Fe-P alloy processed by 8 cycles of the ARB was annealed at various temperatures ranging from 100 to 400 degrees C for 0.6 ks. The sample still showed an ultrafine grained (UFG) structure up to 250 degrees C, however above 300 degrees C it began to replace by equiaxed and coarse grains due to an occurrence of the conventional static recrystallization. The hardness of the annealed copper decreased largely above 300 degrees C. These annealing characteristics of the UFG copper alloy were compared to those of a high purity copper.

Annealing characteristics of nano-grained oxygen free copper processed by accumulative roll-bonding process.

Annealing characteristics of nano-grained oxygen free copper processed by accumulative roll-bonding (ARB) were studied. A nano-grained oxygen free copper fabricated by 8 cycles of the ARB was annealed at various temperatures ranging from 100 to 300 degrees C for 0.6 ks. TEM observation revealed that the ultrafine grains still sustained up to 150 degrees C, however above 200 degrees C they were replaced by equiaxed and coarse grains due to an occurrence of the static recrystallization. The tensile strength of the copper decreased largely above 200 degrees C. These annealing characteristics of the copper were compared with those of a commercially pure aluminum.